New style of precision mold manufacturing, let's go to the Japan International Mold Exhibition together!
發(fā)布時間:2025-03-14
Exhibition Preview: In April 2025, in the season of spring, we will carry our infinite love and pursuit for mold technology, cross the ocean, embark on a journey to Japan, and participate in the highly anticipated "Japan International Mold Exhibition"!
Venue: Tokyo Big Sight, an internationally renowned exhibition center that will witness the brilliant convergence of the global mold industry. Here, every ingenuity and technological innovation will converge into a powerful force driving the industry forward.
Booth information: Our booth is located in Hall 6, 6-L49, a corner full of opportunities and inspiration. Here, we will carefully arrange and showcase our latest precision mold products, cutting-edge technological solutions, and our profound insights into the future mold manufacturing industry.
Highlights of the exhibits: From high-precision injection molds to complex stamping molds, from intelligent mold design software to efficient mold production processes, we will comprehensively showcase our profound expertise and continuous innovation capabilities in the field of precision mold manufacturing.
Looking forward to meeting: We sincerely invite customers, partners, and industry colleagues from all over the world to visit our booth, discuss the latest trends in mold technology, share cutting-edge information on market development, and seek new opportunities for cooperation. Whether it's technical exchanges, business negotiations, or inspiration collisions, we will open our arms and look forward to meeting you.
Exhibition time: April 16-18, 2025. These three days are not only a grand event for the exhibition, but also a precious time for us to seek development and create the future together.
Let's meet in Tokyo and paint a new chapter in mold manufacturing together! On this dynamic and innovative stage, let us work hand in hand to promote the mold industry towards a more brilliant tomorrow.